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GNX200BP晶圓減薄/晶圓拋光 衡鵬供應(yīng)
GNX200BP晶圓減薄/晶圓拋光 衡鵬供應(yīng)
產(chǎn)品價(jià)格:
上架日期:2019-06-20 10:08:59
產(chǎn)地:本地
發(fā)貨地:本地至全國(guó)
供應(yīng)數(shù)量:不限
最少起訂:1臺(tái)
瀏覽量:160
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詳細(xì)說明
    GNX200BP晶圓減薄/晶圓拋光 衡鵬供應(yīng)
    ——又稱晶圓研磨(Wafer Grinding)


    GNX200BP晶圓減薄/晶圓拋光概要
    GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 microns.


    GNX200BP晶圓減薄/晶圓拋光規(guī)格
    Maximum wafer-machining diameter of wafer 64” or 8”
    Grinding Spindle:  Bearing type                 Air bearing, maximum 3600rpm
                       Motor                        2.2kw,4P,high frequency motor 
                       Rapid feed speed             200mm/min
                       Grind feed speed        1 to 999 μm/min 
    Grinding wheel size                        ?250 mm
    Index Table: Number of work spindles            3 
                 Work spindle Bearing type          Mechanical Bearing, or Air Bearing (optional) 
                 Speed of Work Spindles        1 to 600 rpm
    Automatic Sizing Device:
            Wafer thickness measuring system        2 point contact in-process gauge 
            Wafer minimum setting size              1 μm 
            Wafer size display range        0to 1.2 mm; extended range software available
    Table Cleaning Device (Grinder side) Water + Ceramic block
    Wafer Cleaning Unit (Grinder side)        Water + brush, and spin/rinse dry station
    Number of Cassettes                        2 stations for each unit (Grinder & Polish unit)
    Polish head                                     3 Kw AC servo motor for 10 – 460 rpm 
    Oscillation speed                               100–8,000 mm/min.
    Head Load                                       50 –999 g//cm2 
    Pad size                                200mm O.D.
    Polish table speed                              3 Kw AC servo motor for 50 – 200rpm 
    Vacuum Chuck material                           Alumina ceramics (dedicate size of wafer)
    Chuck cleaning                                Brush + Water
    Wafer cleaning                                N.C.W + DI water for Polish surface & Air blow spin dry


    GNX200BP晶圓減薄/晶圓拋光相關(guān)產(chǎn)品:
    衡鵬供應(yīng)
    GDM300晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding

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